View EMIF01-1003M3_8879237.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

november 2010 doc id 13976 rev 2 1/11 11 EMIF01-1003M3 1 line ipad?, emi filter and esd protection in micro qfn package features single line emi symmetri cal (i/o) low-pass filter high efficiency in emi filtering very low pcb space consumption: ? 1.0 mm x 0.6 mm very thin package: 0.6 mm max high efficiency in esd suppression (iec 61000-4-2 level 4) high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging lead free package easy layout and flexibilit y due to single line topology low capacitance complies with following standards iec 61000-4-2 level 4 input and output pins: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883g - method 3015-7 class 3b (all pins) applications where emi filtering in es d sensitive equipment is required: keyboard for mobile phones computers and printers communication systems mcu boards figure 1. pin configuration (top view) figure 2. basic cell configuration description the EMIF01-1003M3 is a 1 line highly integrated device designed to suppress emi/rfi noise in all systems exposed to electromagnetic interference. this filter includes esd protection circuitry, which prevents damage to the application when subjected to esd surges up to 15 kv on all pins. tm : ipad is a trademark of stmicroelectronics sot-883 (jedec mo-236aa compliant) gnd in out r = 100 c = 30 pf typ. @ 0 v line input output www.st.com
characteristics EMIF01-1003M3 2/11 doc id 13976 rev 2 1 characteristics figure 3. electrical characteristics (definitions) table 2. electrical characteristics (t amb = 25 c) table 1. absolute ratings (limiting values at t amb = 25 c unless otherwise specified) symbol parameter value unit v pp esd discharge iec 61000-4-2 air discharge on input and output pins esd discharge iec 61000-4-2 contact di scharge on input and output pins 15 8 kv t j junction temperature 125 c t op operating temperature range -40 to + 85 c t stg storage temperature range -55 to +150 c symbol test conditions min. typ. max. unit v br i r = 1 ma 5 6.5 8 v i rm v rm = 3 v per line 100 na r i/o tolerance 10% 100 c line v r = 0 v dc , v osc = 30 mv, f = 1 mhz 30 39 pf s21 f = 900 mhz -25 db i v i f i rm i r i pp v rm v f v br v cl symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage v = clamping voltage i = peak pulse current i = breakdown current br rm rm rm cl pp r c = line capacitance = cut-off frequency line r= d dynamic resistance f o
EMIF01-1003M3 characteristics doc id 13976 rev 2 3/11 figure 4. s21 attenuation measurement (v bias = 0 v) figure 5. line capacitance versus reverse voltage applied (typical value) db 100.0k 1.0m 10.0m 100.0m 1.0g -30.00 -25.00 -20.00 -15.00 -10.00 -5.00 0.00 i-o f (hz) c line (pf) 0.00e+00 5.00e+00 1.00e+01 1.50e+01 2.00e+01 2.50e+01 3.00e+01 3.50e+01 012345 v r (v) figure 6. esd response to iec 61000-4-2 (+15 kv air discharge) figure 7. esd response to iec 61000-4-2 (- 15 kv air discharge) input output input output
application schematic EMIF01-1003M3 4/11 doc id 13976 rev 2 2 application schematic figure 8. application schematic keypad protection key_col_y key_row_1 key_row_2 gnd in out gnd in out gnd in out
EMIF01-1003M3 ordering information doc id 13976 rev 2 5/11 3 ordering information figure 9. ordering information scheme emif yy - xxx z mx emi filter number of lines information package x = resistance value (ohms z = capacitance value / 10(pf) m3 = sot-883 )
package information EMIF01-1003M3 6/11 doc id 13976 rev 2 4 package information epoxy meets ul94, v0 lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 3. sot-883 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.18 0.2 a1 0.00 0.05 0.00 0.02 b 0.10 0.15 0.20 0.04 0.06 0.08 b1 0.45 0.50 0.55 0.18 0.20 0.22 d 0.60 0.24 e 1.00 0.39 e 0.35 0.14 e1 0.65 0.26 l 0.20 0.25 0.30 0.08 0.10 0.12 l1 0.20 0.25 0.30 0.08 0.10 0.12 figure 10. footprint (dimensions in mm) figure 11. marking e d a a1 b1 3 l1 l e1 1 e b 2 0.40 0.50 0.15 0.20 0.40 0.40 1 2 3 f
EMIF01-1003M3 package information doc id 13976 rev 2 7/11 figure 12. tape and reel specification note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 0.3 2.0 0.1 1.75 0.1 3.5 - 0.05 ? 1.55 0.05 0.55 0.05 0.70 0.05 1.15 0.05 f f f f f f f
recommendation on pcb assembly EMIF01-1003M3 8/11 doc id 13976 rev 2 5 recommendation on pcb assembly 5.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 13. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 90%. 5.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed 4. solder paste with fine particles: powder particle size is 20-45 m. l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 =
EMIF01-1003M3 recommendation on pcb assembly doc id 13976 rev 2 9/11 5.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 5.5 reflow profile figure 14. st ecopack? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
ordering information EMIF01-1003M3 10/11 doc id 13976 rev 2 6 ordering information 7 revision history table 4. ordering information part number marking package weight base qty delivery mode EMIF01-1003M3 f (1) 1. the marking can be rotated by 90 to diferentiate assembly location sot-883 0.96 mg 12000 tape and reel (7?) table 5. document revision history date revision changes 07-oct-2007 1 initial release. 03-nov-2010 2 updated base quantity table 4.
EMIF01-1003M3 doc id 13976 rev 2 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

▲Up To Search▲

Price & Availability of EMIF01-1003M3

	To Download EMIF01-1003M3 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .